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BGA yeniden işleme istasyonu
Created with Pixso.

7 Inch HD Color Touch Screen High Precision K sensor BGA Rework Station ±0.01mm Mounting Accuracy

7 Inch HD Color Touch Screen High Precision K sensor BGA Rework Station ±0.01mm Mounting Accuracy

Marka Adı: HSTECH
Model Numarası: HS-620
Moq: 1 adet
fiyat: Negotation
Ödeme Şartları: T/T
Tedarik Yeteneği: 1 Takım
Ayrıntılı Bilgiler
Menşe yeri:
Çin
Sertifika:
CE,ISO
Ekran Boyutu:
7 inç
Montaj doğruluğu:
±0,01 mm
Güç kaynağı:
AC 100V / 220V±%10 50/60Hz
Toplam Güç:
2600w
Isıtıcı gücü:
Üst 1200W, Alt 1200W
Makine ağırlığı:
30kg
Ambalaj bilgileri:
Ahşap
Yetenek temini:
1 Takım
Ürün Tanımı
Electronic Maintenance High Precision K Sensor BGA Rework Station With 7 Inch HD Color Touch Screen ±0.01mm High Precision Mounting Accuracy
Product Overview

Upgrade your electronics manufacturing and repair capabilities with our state-of-the-art BGA Rework Station. Engineered for precision, efficiency, and versatility, this machine is the ultimate solution for BGA, CSP, uBGA, Flip Chip, and SMD component rework. Whether you are running a high-volume SMT production line or a professional motherboard repair lab, our rework station ensures flawless soldering and desoldering with minimal thermal stress.

Key Features
  • 5 modes stepping motor CCD color align system
  • High precision K-sensor with closed loop control
  • 7-inch HD color touch screen interface
  • Multiple working modes: Semi-auto/Manual/Remove/Mount/Weld
  • Laser centering and positioning system
Technical Specifications
Model HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total Power 2600W
Heater Power Top heater 1200W (Max), bottom heater 1200W (Max)
Temperature Control High precision K-sensor + closed loop control (±1℃ precision)
PCB Size Range Max 140mm×160mm, Min 5mm×5mm
BGA Size Range Max 50mm×50mm, Min 1mm×1mm
Mounting Accuracy ±0.01mm
Machine Weight 30KG
BGA Repair Process
  1. Desoldering: Separate the BGA chip from motherboard
  2. Pad Cleaning: Prepare the surface for new component
  3. Reballing: Apply new solder balls or replace BGA chip
  4. Alignment: Precise positioning using laser and optical systems
  5. Soldering: Secure new BGA chip in place
Applications (Fit for Global Markets)
  • Consumer Electronics Repair: Mobile phone (iPhone, Samsung, Xiaomi, etc.) motherboard repair, laptop PCB repair, tablet, camera, and smart watch BGA chip rework.
  • SMT Production Lines: BGA chip soldering, desoldering, and rework in SMT assembly lines, compatible with SMT placement machines and inspection equipment.
  • Industrial Control & Medical Equipment: Repair and maintenance of BGA chips in industrial control panels, medical devices, and automotive electronics.
  • Electronic Workshops & Training Institutions: Suitable for small electronic repair workshops, technical training institutions, and R&D laboratories.
Why Choose Our BGA Rework Station?
  • High Precision & High Success Rate: ±0.01mm mounting accuracy and intelligent temperature control ensure stable rework results, reducing repair failures and scrap costs.
  • Global Compatibility: Dual voltage (110V/220V) and multi-language touch screen, suitable for users in Europe, America, Southeast Asia and other regions; meets EU RoHS and other environmental standards.
  • User-Friendly Operation: Intuitive touch screen, one-click parameter setting, and modular design, easy to operate even for beginners; no professional technical training required.
  • Durable & Cost-Effective: Industrial-grade materials and high-quality components ensure long service life; low maintenance costs and fast return on investment.
  • Comprehensive After-Sales Support: We provide global after-sales service, including installation guidance, operator training, remote troubleshooting, and spare parts supply. 24/7 online customer service to solve your problems in time.

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